CXK5T8257BTM Ver la hoja de datos (PDF) - Sony Semiconductor

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Fabricante

CXK5T8257BTM

32768-word × 8-bit High Speed CMOS Static RAM

Sony Semiconductor 

Package Outline

Unit: mm

CXK5T8257BTM

28PIN TSOP (Plastic)

∗8.0 ± 0.1

21

8

1.2 MAX

0.1

CXK5T8257BTM/BYM/BM

22

28 1

+ 0.1

0.2 – 0.05

7

0.55 ± 0.1

A

+ 0.07

0.127 – 0.02

+ 0.1

0.05 – 0.05

CXK5T8257BYM

0° to 10°

NOTE: Dimension “∗” does not include mold protrusion.

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

TSOP-28P-L01

TSOP028-P-0000-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

SOLDER PLATING

COPPER / 42 ALLOY

0.2g

28PIN TSOP (Plastic)

∗8.0 ± 0.1

1.2 MAX

8

21

0.1

7

1 28

+ 0.1

0.2 – 0.05

22

0.55 ± 0.1

A

+ 0.07

0.127 – 0.02

+ 0.1

0.05 – 0.05

0° to 10°

NOTE: Dimension “∗” does not include mold protrusion.

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

TSOP-28P-L01R

TSOP028-P-0000-B

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER PLATING

COPPER / 42 ALLOY

PACKAGE WEIGHT

0.2g

–9–

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