CXK5T81000AM Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXK5T81000AM Datasheet PDF : 11 Pages
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Package Outline
Unit: mm
CXK5T81000ATM
32PIN TSOP (PLASTIC)
8.0 ± 0.2
32
17
+ 0.2
1.07 – 0.1
0.1
CXK5T81000ATM/AYM/AM
1
+ 0.08
0.2 – 0.03
0.08 M
16
0.5
A
0.1 ± 0.1
+ 0.05
0.127 – 0.02
NOTE : “∗” Dimensions do not include mold protrusion.
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-32P-L01
TSOP032-P-0820
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
42 ALLOY
0.3g
CXK5T81000AYM
32PIN TSOP (PLASTIC)
8.0 ± 0.2
17
32
+ 0.2
1.07 – 0.1
0.1
16
+ 0.08
0.2 – 0.03
0.08 M
1
0.5
A
0.1 ± 0.1
+ 0.05
0.127 – 0.02
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
PACKAGE STRUCTURE
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-32P-L01R
TSOP032-P-0820-B
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
42 ALLOY
0.3g
– 10 –
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