CXD1268M Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXD1268M Datasheet PDF : 7 Pages
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Package Outline
Unit: mm
20PIN SOP (PLASTIC)
13.0MAX
20
11
CXD1268M
1.8MAX
1.55
0.1 ± 0.1
1
+ 0.1
0.4 – 0.05
0.12 M
1.27
10
0.78MAX
+ 0.1
0.2 – 0.05
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-20P-L071
SOP020-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.3g
–7–
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