CXD1159AQ Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

Fabricante

CXD1159AQ

Sync Signal Generator for Camera

Sony Semiconductor 

Package Outline

Unit: mm

24

25

32PIN QFP (PLASTIC)

9.0 ± 0.2

+ 0.3

7.0 – 0.1

17

16

CXD1159AQ

0.1

+ 0.35

1.5 – 0.15

A

32

1

0.8

9

8

b

0.24 M

+ 0.15

b = 0.30 – 0.10

( 0.30)

+ 0.2

0.1 – 0.1

0˚ to 10˚

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-32P-L01

P-QFP32-7x7-0.8

DETAIL A : SOLDER

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

42 / COPPER ALLOY

0.2g

LEAD SPECIFICATIONS

ITEM

LEAD MATERIAL

LEAD TREATMENT

LEAD TREATMENT THICKNESS

SPEC.

ALLOY 42

Sn-Pb 10%

5-18µm

– 10 –

Sony Corporation

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