1000
100
Cj – VR
(typ.)
f = 1 MHz
Ta = 25°C
10
1
10
100
Reverse voltage VR (V)
CUS05
100
Pulse test
IR – Tj
(typ.)
10
VR = 20 V
15 V
1
10 V
5V
3V
0.1
0.01
0
20
40
60
80 100 120 140
Junction temperature Tj (°C)
PR (AV) – VR
1.0
Rectangular waveform
(typ.)
0.8
0°α 360°
Conduction angle: α
Tj = 125°C
0.6
DC
300°
240°
0.4
180°
120°
60°
0.2
0
0
4
8
12
16
20
Reverse voltage VR (V)
rth (j-a) – t
10000 (1) Device mounted on a ceramic board
Soldering land: 2 mm × 2 mm
(2) Device mounted on a glass-epoxy board
Soldering land: 6 mm × 6 mm
(3) Device mounted on a glass-epoxy board
1000
Standard Soldering pad
(3)
(2)
100
(1)
10
1
0.001
0.01
0.1
1
10
Time t (s)
100
1000
4
2009-11-11