CSPST16-560F Ver la hoja de datos (PDF) - California Micro Devices Corp
Número de pieza
componentes Descripción
Fabricante
CSPST16-560F Datasheet PDF : 4 Pages
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CALIFORNIA MICRO DEVICES
Package Diagram (Bumps Up View)
0.2234mm
2.3968mmmm
0.65
mm
D
0.65
C
mm
B
A
0.35mm
Dia.
Bumps
1234
CSPST08
2.3968mm
0.381mm
0.643mm
0.2234mm
4.9968mm
0.65
mm
D
C
0.65
mm
B
A
0.35mm
Dia.
Bumps
12345678
CSPST16
2.3968mm
0.381mm
0.643mm
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
0.350mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.360mm (sq.)
Solder Flux Ratio
50/50
Solder Paste
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
CSPST
©2000 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com 11/10/2000
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