CPD06 Ver la hoja de datos (PDF) - Central Semiconductor
Número de pieza
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Fabricante
CPD06 Datasheet PDF : 2 Pages
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PROCESS CPD06
General Purpose Rectifier
3 Amp Glass Passivated Rectifier Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GLASS PASSIVATED MESA
89 x 89 MILS
10.2 MILS
66 x 66 MILS
Ni/Au - 5,000Å/2,000Å
Ni/Au - 5,000Å/2,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
1,490
PRINCIPAL DEVICE TYPES
1N5400 thru 1N5408
1N5550 thru 1N5554
1N5624 thru 1N5627
CMR3-02 Series
BACKSIDE CATHODE
w w w. c e n t r a l s e m i . c o m
R4 (22-March 2010)
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