CMPWR150SF Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
CMPWR150SF Datasheet PDF : 15 Pages
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CMPWR150
Specifications
PARAMETER
ESD Protection (HBM)
Pin Voltages
VCC
DRIVE
Storage Temperature Range
Operating Temperature Range
Ambient
Junction
Power Dissipation
SOIC (see Note 1)
ABSOLUTE MAXIMUM RATINGS
RATING
+2000
[GND - 0.5] to [+6.0]
[GND - 0.5] to [V + 0.5]
CC
-40 to +150
0 to +70
0 to +125
1.0
UNITS
V
V
V
°C
°C
°C
W
Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is
based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the
GND pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the
need for additional dedicated copper area. (Please consult factory for thermal evaluation assistance.)
STANDARD OPERATING CONDITIONS
PARAMETER
VCC Input Voltage
Ambient Operating Temperature Range
Load Current
C
EXT
RATING
4.5 to 5.5
0 to +70
0 to 500
10 +10%
UNITS
V
°C
mA
µF
Rev. 3 | Page 4 of 15 | www.onsemi.com
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