CMPWR160SAR Ver la hoja de datos (PDF) - California Micro Devices Corp

Número de pieza

componentes Descripción

Fabricante

CMPWR160SAR

USB Peripheral Power Management

California Micro Devices Corp 

CALIFORNIA MICRO DEVICES

CMPWR160

Absolute Maximum Ratings

Parameter

Rating

Unit

ESD Protection (HBM)

2000

V

VCC/VOUT Voltage

6.0, GND –0.5

V

SD Logic Input Voltage

VCC + 0.5, GND –0.5

V

POR Logic Output Voltage

VOUT + 0.5, GND –0.5

V

Temperature: Storage

–40 to 150

Operating Ambient

0 to 70

˚C

Operating Junction

0 to 125

Power Dissipation Note 1

Internally Limited

Operating Conditions

Parameter

Range

Unit

VCC

4.2 to 5.5

V

Temperature (Ambient)

0 to 70

˚C

Load Current

0 to 500

mA

CEXT

10 ± 10%

µF

Electrical Operating Characteristics

(over operating conditions unless specified otherwise)

Symbol

VOUT

ILIM

IS/C

VR LOAD

VR LINE

VDO

IQ

ISD

IRCC

VIH SD

VIL SD

VPOR

TPOR

RPOR

Parameter

Regulator Output Voltage

Regulator Current Limit

Short-Circuit Current Limit

Load Regulation

Line Regulation

Regulator Dropout Voltage

Quiescent Supply Current

Shutdown Supply Current

VCC Pin Reverse Leakage

Shutdown High Detect

Shutdown Low Detect

POR Detect Threshold

POR Pulse Duration

POR Output Impedance

Conditions

0mA < ILOAD < 500mA

VCC = 5V, ILOAD = 5mA to 500mA

VCC = 4.2V to 5.5V, ILOAD = 5mA

MIN VCC – VOUT for ILOAD = 500mA

Regulator Enabled (No Load)

Regulator Disabled

VOUT = 3.3V, VCC = 0V

VCC = 5V

VCC = 5V

4.2V < VCC < 5.5V

After POR Threshold Detected

Sinking to GND/Sourcing from VCC

MIN

3.135

550

2.8

20

0.2

TYP

3.30

300

75

2

0.6

35

7

1

3.0

1.0

2.9

30

0.5

MAX

3.465

0.9

50

10

10

3.0

40

2

UNIT

V

mA

mA

mV

mV

V

µA

µA

µA

V

V

V

ms

kΩ

TDISABLE Shutdown Temperature

160

˚C

THYST

Thermal Hysteresis

20

˚C

Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is based on a printed

circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical multi-layer boards

using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area. (Please

consult with factory for thermal evaluation assistance.)

©2000 California Micro Devices Corp. All rights reserved. SmartOR™ is a trademark of California Micro Devices Corporation.

215 Topaz Street, Milpitas, California 95035  Tel: (408) 263-3214

Fax: (408) 263-7846

2

www.calmicro.com

12/5/2000

Share Link: