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TC1173

300mA CMOS LDO with Shutdown ERROR Output and Bypass

TelCom Semiconductor Inc => Microchip 

300mA CMOS LDO With Shutdown,

ERROR Output, And Bypass

TC1173

ABSOLUTE MAXIMUM RATINGS*

Input Voltage .............................................................. 6.5V

Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3)

Power Dissipation .................... Internally Limited (Note 7)

Operating Temperature .................... – 40°C < TJ < 125°C

Storage Temperature ............................ – 65°C to +150°C

Maximum Voltage on Any Pin ............ VIN +0.3V to – 0.3V

Lead Temperature (Soldering, 10 Sec.) ................ +300°C

*Absolute Maximum Ratings indicate device operation limits beyond dam-

age may occur. Device operation beyond the limits listed in Electrical

Characteristics is not recommended.

ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted.

BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

VIN

IOUTMAX

VOUT

∆VOUT/∆T

∆VOUT/∆VIN

∆VOUT/VOUT

VIN – VOUT

ISS1

ISS2

PSRR

IOUTSC

∆VOUT∆PD

eN

Input Operating Voltage

Maximum Output Current

Output Voltage

VOUT Temperature Coefficient

Line Regulation

Load Regulation

Dropout Voltage (Note 4)

Supply Current

Shutdown Supply Current

Power Supply Rejection Ratio

Output Short Circuit Current

Thermal Regulation

Output Noise

Note 1

Note 2

—

300

—

VR - 2.5%

—

(VR + 1V) < VIN < 6V

—

IL = 0.1mA to IOUTMAX (Note 3)

—

IL = 0.1mA

—

IL = 100mA

IL = 300mA

SHDN = VIH

—

SHDN = 0V

—

FRE ≤ 1kHz

—

VOUT = 0V

—

Note 5

—

F = 1kHz, COUT = 1µF,

—

RLOAD = 50Ω

—

6.0

—

—

VR ± 0.5%

—

VR + 2.5%

—

—

40

0.05

0.35

0.5

2.0

20

30

80

160

240

480

50

90

0.05

0.5

60

—

550

650

0.04

—

260

—

V

mA

V

ppm/°C

%

%

mV

µA

µA

dB

mA

V/W

nV/√Hz

SHDN Input

VIH

SHDN Input High Threshold

VIL

SHDN Input Low Threshold

45

—

—

%VIN

—

—

15

%VIN

ERROR Output

VMIN

Minimum Operating Voltage

1.0

—

—

V

VOL

Output Logic Low Voltage

1mA Flows to ERROR

—

—

400

mV

VTH

ERROR Threshold Voltage

—

0.95 x VR

—

V

VOL

ERROR Positive Hysteresis Note 7

—

50

—

mV

NOTES: 1. VR is the user-programmed regulator output voltage setting.

2. TC VOUT = (VOUTMAX – VOUTMIN) x 10 6

VOUT x ∆T

3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA

to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.

4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.

5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load

or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.

6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the

thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.

7. Hysteresis voltage is referenced to VR.

TC1173-2 2/2/00

2

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