CM3109-00SH Ver la hoja de datos (PDF) - California Micro Devices Corp

Número de pieza

componentes Descripción

Fabricante

CM3109-00SH

2A Sink/Source Regulator for Front Side Bus and DDR Memory Bus Termination

California Micro Devices Corp 

CM3109

Application Information

PCB Layout Considerations

The CM3109-00SB/SH has a heat spreader attached

to the underneath of the PSOP-8 package in order for

heat to be transferred much easier from the package to

the PCB. The heat spreader is a copper pad of dimen-

sions just smaller than the package itself. By position-

ing the matching pad on the PCB top layer to connect

to the spreader during manufacturing, the heat will be

transferred between the two pads. The drawing below

shows the recommended PCB layout. Note that there

are six vias on either side to allow the heat to dissipate

into the ground and power planes on the inner layers of

the PCB. Vias can be placed underneath the chip, but

this can cause blockage of the solder. The ground and

power planes should be at least 2 sq in. of copper by

the vias. It also helps dissipation to spread if the chip is

positioned away from the edge of the PCB, and not

near other heat dissipating devices. A good thermal

link from the PCB pad to the rest of the PCB will ensure

a thermal link from the CM3109 package to ambient,

θJA, of around 40°C/W.

Figure 17. Recommended Heat Sink PCB Layout

© 2004 California Micro Devices Corp. All rights reserved.

10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214

▲ Fax: 408.263.7846 ▲ www.calmicro.com

01/15/04

Share Link: