CM2030(2012) Ver la hoja de datos (PDF) - ON Semiconductor
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CM2030 Datasheet PDF : 11 Pages
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CM2030
APPLICATION INFORMATION (Cont’d)
LAYOUT NOTES
1) Differential TMDS Pairs should be designed as normal 100W HDMI Microstrip. Single Ended (decoupled) TMDS traces
underneath MediaGuardt, and traces between MediaGuardt and Connector should be tuned to match chip/connector
IBIS parasitics.
2) Level Shifter signals should be biased with a weak pullup to the desired local LV_SUPPLY. If the local ASIC includes
sufficient pullups to register a logic high, then external pullups may not be needed.
3) Place MediaGuardt as close to the connector as possible, and as with any controlled impedance line always avoid
placing any silk−screen printing over TMDS traces.
4) CM2020/CM2030 footprint compatibility − For the CM2030, Pin 37 becomes the VCEC power supply pin for the slew−rate
limiting circuitry. This can be supplied by a 0 W jumper to VCEC which should be depopulated to utilize the CM2020. The
100 nF CBYP is recommended for all applications.
5) CEC pullup isolation. The 27k RCEC and a Schottky DCEC provide the necessary isolation for the CEC pullup.
Note: This circuitry is used only in the CM2020. Depopulate the components for CM2030 applications in a CM2020/
CM2030 dual footprint layout.
6) Footprint compatibility − The CM2030 has (built−in) internal backdrive protection.
The CM2020 does not not have internal backdrive protection and requires the external RCEC and DCEC components.
7) (For CM2030) If CEC firmware is not implemented, do not populate with 0 W resistor. If CEC firmware is implemented,
then populate with 0 W resistor. (For CM2020) Populate with 0 W resistor in either case.
Figure 9. Typical Application for CM2030
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