CM2006-02QS Ver la hoja de datos (PDF) - California Micro Devices Corp
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CM2006-02QS Datasheet PDF : 6 Pages
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PRELIMINARY
CM2006
Specifications
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER
CONDITIONS
MIN TYP MAX UNITS
ICC_DDC
ICC
VCC_DDC Supply Current
VCC Supply Current
VCC_DDC = 5.0V
VCC = 5V; SYNC inputs at GND or VCC;
SYNC outputs unloaded
10 μA
1
mA
VCC = 5V; SYNC inputs at 3.0V;
SYNC outputs unloaded
2.0 mA
VF
ESD Diode Forward Voltage
VIH
Logic High Input Voltage
VIL
Logic Low Input Voltage
IF = 10mA
VCC = 5.0V; Note 2
VCC = 5.0V; Note 2
1.0
V
2.0
V
0.5
V
VHYS
VOH
VOL
Hysteresis Voltage
Logic High Output Voltage
Logic Low Output Voltage
VCC = 5.0V; Note 2
IOH = 0mA, VCC = 5.0V; Note 2
IOL = 0mA, VCC = 5.0V; Note 2
400
mV
4.0
V
0.15 V
ROUT
IIN
SYNC Driver Output Resistance
Input Current
VIDEO Inputs
VCC = 5.0V; SYNC Inputs at GND or 3.0V
VCC = 5.0V; VIN = VCC or GND
7
15 24
Ω
±10 μA
SYNC_IN1, SYNC_IN2 Inputs
VCC = 5.0V; VIN = VCC or GND
±10 μA
IOFF
IBACKDRIVE
Level Shifting N-MOSFET "OFF" State
Leakage Current
Current conducted from input pins when Vcc
is powered down.
(VCC_DDC - VDDC_IN) < 0.4V; VDDC_OUT = VCC_DDC
(VCC_DDC - VDDC_OUT) < 0.4V; VDDC_IN = VCC_DDC
VCC < VINPUT_PIN ; Note 6
10 μA
10 μA
10
μA
VON Voltage Drop Across Level-shifting
N-MOSFET when "ON"
VCC_DDC = 2.5V; VS = GND; IDS = 3mA;
0.18 V
CIN_VID VIDEO Input Capacitance
tPLH SYNC Driver L => H Propagation Delay
VCC = 5.0V; VIN = 2.5V; f = 1MHz; Note 4
VCC = 2.5V; VIN = 1.25V; f = 1MHz; Note 4
CL = 50pF; VCC = 5.0V; Input tR and tF < 5ns
3
pF
3.5 pF
12 ns
tPHL
tR, tF
VESD1
SYNC Driver H => L Propagation Delay
SYNC Driver Output Rise & Fall Times
ESD Withstand Voltage, Sync_out pins only
CL = 50pF; VCC = 5.0V; Input tR and tF < 5ns
CL = 50pF; VCC = 5.0V; Input tR and tF < 5ns
VCC = 5V; Notes 3, 4, & 5
12 ns
3
ns
±2
kV
VESD ESD Withstand Voltage
VCC = 5V; Notes 3, 4, & 6
±8
kV
Note 1: All parameters specified over standard operating conditions unless otherwise noted
Note 2: These parameters apply only to the SYNC drivers. Note that ROUT = RT + RBUFFER.
Note 3: Per the IEC-61000-4-2 International ESD Standard, Level 4 contact discharge method. BYP and VCC must be bypassed to
GND via a low impedance ground plane with a 0.22μF, low inductance, chip ceramic capacitor at each supply pin. ESD
pulse is applied between the applicable pins and GND. ESD pulses can be positive or negative with respect to GND. Appli-
cable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2. All pins are ESD pro-
tected to the industry standard ±2kV Human Body Model (MIL-STD-883, Method 3015).
Note 4: This parameter is guaranteed by design and characterization.
Note 5: This specification applies to the SYNC_OUT pins only.
Note 6: Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2.
© 2006 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/21/06
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