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CM1426-04CP Ver la hoja de datos (PDF) - ON Semiconductor

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CM1426-04CP Datasheet PDF : 17 Pages
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CM1426
Mechanical Details
CSP Mechanical Specifications
CM1426 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the California Micro Devices CSP Package Information
document.
CM1426-04 Mechanical Specifications
Package dimensions are presented below.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
10
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 1.915 1.960 2.005 0.0754 0.0772 0.0789
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.091 0.0110
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Package Dimensions for CM1426-04
Chip Scale Package
Rev. 2 | Page 11 of 17 | www.onsemi.com

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