CM1450-08CS Ver la hoja de datos (PDF) - California Micro Devices Corp

Número de pieza

componentes Descripción

Fabricante

CM1450-08CS

LCD & Camera EMI Filter Array with ESD Protection

California Micro Devices Corp 

Mechanical Details (cont’d)

CM1450-08CS/CP Mechanical Specifications

The package dimensions for the CM1450-08CS/CP

are presented below.

PACKAGE DIMENSIONS

Package

Custom CSP

Bumps

20

Millimeters

Inches

Dim

Min Nom Max Min

Nom Max

A1 3.955 4.000 4.045 0.1557 0.1575 0.1593

A2 1.413 1.458 1.503 0.0556 0.0574 0.0592

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.200 0.250 0.300 0.0079 0.0098 0.0118

C2 0.244 0.294 0.344 0.0096 0.0116 0.0135

D1 0.561 0.605 0.649 0.0221 0.0238 0.0255

D2 0.355 0.380 0.405 0.0140 0.0150 0.0159

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

PRELIMINARY

CM1450

Mechanical Package Diagrams

BOTTOM VIEW

A1

C1

B2

B1

C

B

A

A

1234567 8

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

SOLDER BUMPS

SIDE

VIEW

D1

D2

DIMENSIONS IN MILLIMETERS

Package Dimensions for

CM1450-08CS/CP Chip Scale Package

© 2005 California Micro Devices Corp. All rights reserved.

01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7

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