CM1230 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

CM1230

2, 4, and 8-Channel Low-Capacitance ESD Protection Array

ON Semiconductor 

CM1230

APPLICATION INFORMATION

Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS

Parameter

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Flux Ratio

Solder Paste Type

Pad Protective Finish

Tolerance − Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous

Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste

Value

0.275 mm

Round

Non−Solder Mask defined pads

0.325 mm Round

0.125 − 0.150 mm

0.330 mm Round

50/50 by volume

No Clean

OSP (Entek Cu Plus 106A)

±50 mm

±20 mm

60 seconds

260°C

Non−Solder Mask Defined Pad

0.275 mm DIA.

Solder Stencil Opening

0.330 mm DIA.

Solder Mask Opening

0.325 mm DIA.

Figure 5. Recommended Non−Solder Mask Defined Pad Illustration

Figure 6. Lead−free (SnAgCu) Solder Ball Reflow Profile

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