CM1224 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

CM1224

2 and 4-Channel Low Capacitance ESD Protection Arrays

ON Semiconductor 

CM1224

PACKAGE DIMENSIONS

SOT−143

CASE 318A−06

ISSUE U

D

e

A

E1

b1

e1

B

TOP VIEW

A A1

SIDE VIEW

D

GAUGE

PLANE

E

L2

SEATING

PLANE

L

DETAIL A

3X b

0.20 M C A-B D

c

0.10 C

C

SEATING

PLANE

H

DETAIL A

END VIEW

RECOMMENDED

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIM­

UM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO­

TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,

AND GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE.

DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR

PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL

NOT EXCEED 0.25 PER SIDE.

5. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H.

6. DATUMS A AND B ARE DETERMINED AT DATUM H.

MILLIMETERS

DIM MIN MAX

A 0.80 1.12

A1 0.01 0.15

b 0.30 0.51

b1 0.76 0.94

c 0.08 0.20

D 2.80 3.05

c

E 2.10 2.64

E1 1.20 1.40

e

1.92 BSC

e1

0.20 BSC

L 0.35 0.70

L2

0.25 BSC

1.92

4X

0.75

2.70

0.20

0.96

3X

0.54

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

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