CM1220(2010) Ver la hoja de datos (PDF) - ON Semiconductor

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componentes Descripción

Fabricante

CM1220
(Rev.:2010)

4 and 8-Channel ESD Protection Arrays in CSP

ON Semiconductor 

CM1220

Application Information

PARAMETER

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Flux Ratio

Solder Paste Type

Pad Protective Finish

Tolerance — Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183ûC)

Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder

Paste

VALUE

0.240mm

Round

Non-Solder Mask defined pads

0.290mm Round

0.125mm - 0.150mm

0.300mm Round

50/50 by volume

No Clean

OSP (Entek Cu Plus 106A)

+50µm

+20µm

60 seconds

260°C

Non-Solder Mask Defined Pad

0.240mm DIA.

Solder Stencil Opening

0.300mm DIA.

Solder Mask Opening

0.290mm DIA.

Figure 2. Recommended Non-Solder Mask Defined Pad Illustration

Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile

Rev. 2 | Page 5 of 10 | www.onsemi.com

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