CM1218-02(2011) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
CM1218-02 Datasheet PDF : 16 Pages
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CM1218
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B−01
ISSUE B
D
−X−
A
L
5
4
E
−Y−
HE
12 3
b 5 PL
c
e
0.08 (0.003) M X Y
SOLDERING FOOTPRINT*
0.3
0.0118
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MILLIMETERS
DIM MIN
NOM MAX
A 0.50
0.55
0.60
b 0.17
0.22
0.27
c 0.08
0.13
0.18
D 1.50
1.60
1.70
E 1.10
1.20
1.30
e
0.50 BSC
L 0.10
0.20
0.30
H E 1.50
1.60
1.70
STYLE 2:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
MIN
0.020
0.007
0.003
0.059
0.043
0.004
0.059
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.008
0.063
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
1.35
0.0531
1.0
0.0394
0.45
0.0177
0.5 0.5
0.0197 0.0197
ǒ Ǔ SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
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