CM1205 Ver la hoja de datos (PDF) - ON Semiconductor
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CM1205 Datasheet PDF : 5 Pages
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CM1205
PACKAGE DIMENSIONS
WLCSP10, 3.10x1.15
CASE 567BM−01
ISSUE O
D
PIN A1
REFERENCE
ÈÈÈÈ
2X
0.05 C
AB
E
2X
0.05 C
TOP VIEW
OptiGuard Option
A2
0.05 C ÉÉÉÉÉÉÉÉ
A
0.05 C
NOTE 3 A1
SIDE VIEW
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.60 0.75
A1 0.23 0.29
A2
0.40 REF
b 0.34 0.39
D
3.10 BSC
E
1.15 BSC
e
0.65 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
10X b
0.05 C A B
B
0.03 C
e
e
A
1
2
3
4
5
BOTTOM VIEW
0.65
PITCH
10X
0.25
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
OptiGuardt is a trademark of Semiconductor Components Industries, LLC.
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CM1205/D
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