CM1205(2010) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
CM1205 Datasheet PDF : 8 Pages
| |||
CM1205
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260ûC
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Rev. 3 | Page 4 of 8 | www.onsemi.com
Share Link: 