CM1204 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

CM1204

4-Channel ESD Array in CSP

ON Semiconductor 

CM1204

APPLICATION INFORMATION

Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by

ON Semiconductor.

Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS

Parameter

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Flux Ratio

Solder Paste Type

Pad Protective Finish

Tolerance — Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous

Maximum Soldering Temperature

Value

0.275 mm

Round

Non−Solder Mask defined pads

0.325 mm Round

0.125 mm − 0.150 mm

0.330 mm Round

50/50 by volume

No Clean

OSP (Entek Cu Plus 106 A)

±50 mm

±20 mm

60 seconds

260°C

Figure 3. Recommended Non−Solder Mask Defined Pad Illustration

Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile

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