120608 Ver la hoja de datos (PDF) - California Micro Devices Corp
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Fabricante
120608 Datasheet PDF : 7 Pages
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CM1206
Mechanical Details
The CM1206 devices are packaged in custom Chip
Scale Packages (CSP).
CM1206-04 6-bump CSP Mechanical Specifications
The CM1206-04 devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
6
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 1.759 1.804 1.849 0.0693 0.0710 0.0728
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
B3 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.638 0.707 0.776 0.0251 0.0278 0.0306
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuardTM
Coating
3
2
1
BA
D1
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
D2
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1206-04 6-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1206-04
CHIP SIZE (mm)
1.804 X 1.154 X 0.707
POCKET SIZE (mm)
B0 X A0 X K0
1.98 X 1.32 X 0.91
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
Top
Cover
Tape
Ko
Po
Ao
Bo
10 Pitches Cumulative
±To0l.e2ramnmce On Tape
W
QTY
PER
REEL
3500
P0
P1
4mm 4mm
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P1
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5
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