CF5035AL Ver la hoja de datos (PDF) - Nippon Precision Circuits
Número de pieza
componentes Descripción
Fabricante
CF5035AL Datasheet PDF : 8 Pages
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PAD LAYOUT
(Unit: µm)
CF5035 series
VDD TEST
7
6
Q (1080,1320)
5
Y
1
2
34
(0,0) INHN XIN XOUT VSS
X
Chip size: 1.08 × 1.32mm
Chip thickness: 300 ± 30µm
PAD size: 100µm × 100µm (TEST: 80µm × 80µm)
Chip base: VSS potential
PIN DESCRIPTION and PAD DIMENSIONS
No.
Name
I/O
Description
1
INHN
I
Output state control input. Oscillator stops when LOW.
Power-saving pull-up resistor built-in.
2
XIN
I
Oscillator input
Crystal connection pins.
3
XOUT
O
Oscillator output
Crystal is connected between XIN and XOUT.
4
VSS
–
(–) ground
5
Q
O
Output. Output frequency. High impedance in standby mode
6
TEST
I
Test (leave open)
7
VDD
–
(+) supply voltage
BLOCK DIAGRAM
Pad dimensions [µm]
X
Y
205
135
461
135
734
135
945
135
945
1185
494
1195
135
1185
VDD VSS
INHN
Rf
CMOS
Q
XIN
CIN
COUT
XOUT
SEIKO NPC CORPORATION —2
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