HT7050A Ver la hoja de datos (PDF) - Holtek Semiconductor
Número de pieza
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HT7050A Datasheet PDF : 16 Pages
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Pad Assignment
HT70XX (except HT7022A)
(0 ,0 )
1
2
3
Chip size: 1317 ´ 1158 (mm)2
* The IC substrate should be connected to VDD in the
PCB layout artwork.
HT7022A only
Pad Coordinates
HT70XX (except HT7022A)
Pad No.
1
2
3
X
-483.30
-234.60
443.90
HT7022A only
Pad No.
1
2
3
X
-434.34
120.65
774.70
HT70XX
Unit: mm
Y
-379.50
-399.50
-386.00
Unit: mm
Y
394.97
461.01
412.75
1
2
3
(0 ,0 )
Chip size: 2032 ´ 1321 (mm)2
* The IC substrate should be connected to VDD in the
PCB layout artwork.
Absolute Maximum Ratings
Supply Voltage, except HT7022A ..................................................................................................VSS-0.3V to VSS+26V
Supply Voltage, HT7022A only ....................................................................................................................-0.3V to 13V
Output Voltage ...........................VSS-0.3V to VDD+0.3V
Storage Temperature ............................-50°C to 125°C
Operating Temperature ...............................0°C to 70°C
Output Current......................................................50mA
Power Consumption ..........................................200mW
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
Rev. 1.60
3
January 14, 2003
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