BUJ302AD Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
BUJ302AD Datasheet PDF : 14 Pages
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NXP Semiconductors
8. Soldering
BUJ302AD
NPN power transistor
1.00
4.60
5.75 5.65
1.15
3.60
2.45
6.00
2.40 2.30
7.00
6.15
5.90
5.80
1.80
4.725
6.50
6.00
6.125
0.30
solder lands
solder resist
occupied area
solder paste
1.50
4.57
1.30
1.40
1.65
SOT428
Fig 16. Reflow soldering footprint for SOT428 (DPAK)
BUJ302AD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 28 March 2011
© NXP B.V. 2011. All rights reserved.
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