Q67060-S6072-A101(2003) Ver la hoja de datos (PDF) - Infineon Technologies
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Q67060-S6072-A101 Datasheet PDF : 15 Pages
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Data sheet BTS 6133 D
Thermal Characteristics
Parameter and Conditions
Symbol
Thermal resistance
chip - case: RthJC
junction - ambient (free air): RthJA
SMD version, device on PCB 5):
Values
Unit
min typ max
--
-- 1.1 K/W
-- 80
--
-- 45 55
Electrical Characteristics
Parameter and Conditions
at Tj= 25, Vbb = 12 V unless otherwise specified
Symbol
Values
Unit
min typ max
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to pin 1,5)
VIN= 0, Vbb= 5.5V, IL = 7.5 A
Tj=25 °C:
Tj=150 °C:
VIN= 0, Vbb= 12V, IL = 7.5 A
Tj=25 °C:
Tj=150 °C:
Nominal load current (Tab to pin 1,5)
ISO Proposal: VON ≤ 0.5 V, TC = 85°C, Tj ≤ 150°C
SMD 5): VON ≤ 0.5 V, TA = 85°C, Tj ≤ 150°C
Turn-on time
Turn-off time
RL = 2.2 Ω, Tj=-40...150 °C
to 90% VOUT:
to 10% VOUT:
Slew rate on
25 to 50% VOUT, RL = 2.2 Ω, Tj=-40...150 °C
Slew rate off
50 to 25% VOUT, RL = 2.2 Ω, Tj=-40...150 °C
RON
IL(ISO)
IL(nom)
ton
toff
dV /dton
-dV/dtoff
-- 10 14 mΩ
-- 18 26
--
8 10
-- 14 18
33 41
-- A
8 10
--
-- 250 500 µs
-- 250 500
-- 0.3 0.5 V/µs
-- 0.3 0.6 V/µs
5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air.
Infineon Technologies AG
Page 3 of 15
2003-Oct-01
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