NXP Semiconductors
BT1308W series D
Triacs logic level
5. Thermal characteristics
Table 4. Thermal characteristics
Symbol Parameter
Conditions
Min Typ Max Unit
Rth(j-sp)
thermal resistance from junction full cycle; see Figure 6
to solder point
-
-
15
K/W
Rth(j-a) thermal resistance from junction full cycle
to ambient
for minimum footprint; see Figure 13 -
156 -
K/W
for pad area; see Figure 14
-
70
-
K/W
102
Zth(j-sp)
(K/W)
10
003aac210
1
10-1
10-2
10-5
10-4
10-3
10-2
10-1
P
tp
t
1
10
tp (s)
Fig 6. Transient thermal impedance from junction to solder point as a function of pulse width
BT1308W_SER_D_1
Product data sheet
Rev. 01 — 27 February 2008
© NXP B.V. 2008. All rights reserved.
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