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BS616UV4016ECG10 Ver la hoja de datos (PDF) - Brilliance Semiconductor

Número de pieza
componentes Descripción
Fabricante
BS616UV4016ECG10
BSI
Brilliance Semiconductor BSI
BS616UV4016ECG10 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
BSI
n ORDERING INFORMATION
BS616UV4016 X X Z Y Y
BS616UV4016
SPEED
85: 85ns
10: 100ns
PKG MATERIAL
-: Normal
G: Green
P: Pb free
GRADE
C : +0oC ~ +70oC
I : -40oC ~ +85oC
PACKAGE
D: DICE
E: TSOP 2-44
A: BGA-48-0608
Note:
BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not
authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in
significant injury or death, including life-support systems and critical medical instruments.
n PACKAGE DIMENSIONS
NOTES
:
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
BALL PITCH e = 0.75
D
E
N
D1
E1
8.0
6.0
48
5.25
3.75
D1
VIEW A
48 mini-BGA (6 x 8mm)
R0201-BS616UV4016
9
Revision 1.3
Sep. 2005

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