BGY204 Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
BGY204 Datasheet PDF : 11 Pages
| |||
Philips Semiconductors
UHF amplifier module
Product specification
BGY204
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210 °C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Footprints for soldering should cover the module contact
area +0.1 mm on all sides.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 °C and damage the module.
The maximum temperature profile and soldering time is
indicated as follows (see Fig.16):
t = 350 s at 100 °C
t = 300 s at 125 °C
t = 200 s at 150 °C
t = 100 s at 175 °C
t = 50 s at 200 °C
t = 5 s at 250 °C (maximum temperature).
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Triclean B/S
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
300
handbook, halfpage
T mb
( oC)
200
MLB740
100
0
0
100
200
300 t (s) 400
Fig.16 Maximum allowable temperature profile.
1996 May 21
9
Share Link: 