BD9873CP-V5 Ver la hoja de datos (PDF) - ROHM Semiconductor
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BD9873CP-V5 Datasheet PDF : 13 Pages
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BD9873CP-V5,BD9874CP-V5
●Power Dissipation
15
(3) 11.0W
10
(2) 6.5W
5
(1) 2.0W
Technical Note
(1) No heat sink
(2) Aluminum heat sink
50×50×2（mm3）
(3) Aluminum heat sink
100×100×2（mm3）
0
0
25
50
75
100
125
150
AMBAIEMNBTIETNETMTPEEMRAPTEURRAETU: TRaE[C: ]Ta[℃]
Fig.28
●Tj (tip junction temperature) calculating method
It is impossible to measure the tip junction temperature Tj outside the IC, but it can be calculated by the formula shown below.
Calculation method of tip junction temperature Tj
Tj=(W×θj－c)＋Tc
W
θj－c
Tc
：Power consumed by IC (calculated by the formula below)
：Thermal resistance from the tip to the back of the package
12.5 ºC/W for TO220 package
：IC surface temperature (to be measured by thermocouple, etc.)
Calculation method of electric power W consumed by IC
W=Vin×Iin－VOUT×IOUT－VF×IOUT×（1－VOUT/Vin）
Vin
Iin
VOUT
IOUT
VF
： Input voltage
： Input voltage
： Output voltage
： Load Current
： Forward voltage of Schottky diode
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9/12
2009.07 - Rev.A
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