BD8201FM Ver la hoja de datos (PDF) - ROHM Semiconductor

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componentes Descripción

Fabricante

BD8201FM

Power Driver For CD/DVD Players

ROHM Semiconductor 

4/4

４． The following table shows logics for loading driver operation.

IN P U T

O UTPUT

L D M U TE

LDIN

LDCO NT

O UT+

O UT-

FUNCTIO N

L

X

X

Hi Z

Hi Z

H igh im pe dan c e

H

X

< 0 .7 V

Hi Z

H

L

> 0 .7 V

L

H

H

> 0 .7 V

H

H

M or Hi Z

> 0 .7 V

L

Hi Z

H igh im pe dan c e

H

REV mode

L

FWD mode

L

Bre ak mode

Although the output voltage can be changed by the input voltage through the LDCONT terminal (gain 6dB Typ.), it never exceeds the maximum output voltage restricted

by the power supply voltage even if applying a voltage much larger than the normal value.

Also, output of loading driver corresponded to LDCONT terminal becomes High-impedance mode by setting LDCONT terminal (3pin) to 0.7V or below.

５．Protection circuit for VCC and GND fault

This IC contains protection circuit for VCC and GND fault to prevent itself from breaking caused by short between BTL driver output pin and VCC (VCC fault) or BTL

driver output pin and GND (GND fault).

Make sure output pin should not short to VCC or GND. However in case VCC and GND fault occur, internal circuit prevents IC from breaking by limiting current.

(available for only CH1, CH2, CH3)

Protection circuit for GND fault is contained to prevent from breaking caused by short between loading driver output pin and GND. Make sure output pin should not short

to GND. However in case GND fault occurs, internal circuit prevents IC from breaking by limiting current.

● Caution on use

１．Bypass capacitor

Connect bypass capacitor(0.1μF) close to this IC pin between power supplies. Also, connect capacitor（10μF〜） which is greater capacity and small ESR close to power

supply terminal for reducing impedance.

２．TEST terminal

TEST terminal is pulled-up in IC, therefore use it as open or by shorted with VCC.

３．About absolute maximum ratings

Exceeding the absolute maximum ratings, such as the applied voltage or the operating temperature range, may cause permanent device damage. As these cases cannot be

limited to the broken short mode or the open mode, if a special mode where the absolute maximum ratings may be exceeded is assumed, it is recommended to take

mechanical safety measures such as attaching fuses..

４．About power supply lines

As a measure against the back current regenerated by a counter electromotive force of the motor, a capacitor to be used as a regenerated-current path can be installed

between the power supply and GND and its capacitance value should be determined after careful check that any problems, for example, a leak capacitance of the

electrolytic capacitor at low temperature, are not found in various characteristics.

５．About GND potential

The electric potential of the GND terminal must be kept lowest in the circuitry at any operation states

６．About thermal design

With consideration of the power dissipation (Pd) under conditions of actual use, a thermal design provided with an enough margin should be done.

７．About operations in a strong electric field

When used in a strong electric field, note that a malfunction may occur.

８．ASO

When using this IC, the output Tr must be set not to exceed the values specified in the absolute maximum ratings and ASO.

９．Thermal shutdown circuit

This IC incorporates a thermal shutdown circuit (TSD circuit). When the chip temperature reaches the value shown below, the coil output to the motor will be set to open.

The thermal shutdown circuit is designed only to shut off the IC from a thermal runaway and not intended to protect or guarantee the entire IC functions.

Therefore, users cannot assume that the TSD circuit once activated can be used continuously in the subsequent operations.

TSD ON Temperature [℃]（typ.）

175

Hysteresis Temperature [℃]（typ.）

25

１０．About earth wiring patterns

When a small signal GND and a large current GND are provided, it is recommended that the large current GND pattern and the small signal GND pattern should be separated

and grounded at a single point of the reference point of the set in order to prevent the voltage of the small signal GND from being affected by a voltage change caused by the

resistance of the pattern wiring and the large current.

Make sure that the GND wiring patterns of the external components will not change, too.

１１. About each input terminal

This IC is a monolithic IC which has a P+ isolations and P substrate to isolate elements each other.

This P layer and an N layer in each element form a PN junction to construct various parasitic elements.

Due to the IC structure, the parasitic elements are inevitably created by the potential relationship.

Activation of the parasitic elements can cause interference between circuits and may result in a malfunction or, consequently, a fatal damage. Therefore, make sure that the IC

must not be used under

conditions that may activate the parasitic elements, for example, applying the lower voltage than the ground level(GND, P substrate) to the input terminals.

Note that, while not applying the power supply voltage to the IC, any voltage must not be applied to the input terminals. In addition, do not apply the voltage to input

terminals without applying the

power supply voltage to the IC. Also while applying the power supply voltage, each input terminal must be the power supply voltage or less; or within the guaranteed values in

the electric characteristics.

REV. A

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