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BC846DS Ver la hoja de datos (PDF) - NXP Semiconductors.

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BC846DS Datasheet PDF : 12 Pages
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NXP Semiconductors
BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Tj
junction temperature
-
Tamb
ambient temperature
55
Tstg
storage temperature
65
Max Unit
150
°C
+150 °C
+150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
500
Ptot
(mW)
400
006aab621
300
200
100
0
75
25
25
75
125
175
Tamb (°C)
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve SOT457 (SC-74)
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
Per device
Rth(j-a)
thermal resistance from
junction to ambient
Conditions
in free air
in free air
Min Typ Max
[1] -
-
500
-
-
250
[1] -
-
328
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Unit
K/W
K/W
K/W
BC846DS_1
Product data sheet
Rev. 01 — 17 July 2009
© NXP B.V. 2009. All rights reserved.
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