BC-148 Ver la hoja de datos (PDF) - Analog Devices

Número de pieza

componentes Descripción

Fabricante

BC-148

148-Lead Chip Scale Package Ball Grid Array

Analog Devices 

a

*1.40 MAX

148-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-148)

Dimensions shown in millimeters

9.10

9.00 SQ

8.90

BALL A1

PAD CORNER

TOP VIEW

DETAIL A

7.50

BSC SQ

A1 CORNER

INDEX AREA

16 151413121110 9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

0.50 BSC

DETAIL A

*1.11 MAX

0.15 MIN

0.35

0.30

0.25

BALL DIAMETER

SEATING

PLANE

*COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION

TO DIMENSIONS INDICATED BY AN ASTERISK.

COPLANARITY

0.08

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