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BAS16LD Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
BAS16LD
NXP
NXP Semiconductors. NXP
BAS16LD Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
NXP Semiconductors
9. Package outline
BAS16LD
Single high-speed switching diode
0.65
0.4
0.55
max
0.30
2
0.22
0.65
1.05
0.95
0.30
1
0.22
0.55
0.45
Dimensions in mm
cathode marking on top side
10-08-06
Fig 8. Package outline BAS16LD (SOD882D)
10. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
BAS16LD
SOD882D 2 mm pitch, 8 mm tape and reel
Packing quantity
10 000
-315
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
BAS16LD
Product data sheet
1.4
0.2
solder lands
0.8
0.6 0.7
solder resist
(2×)
(2×) (2×)
solder paste
Dimensions in mm
0.3
0.4
1
1.3
Reflow soldering is the only recommended soldering method.
Fig 9. Reflow soldering footprint BAS16LD (SOD882D)
sod882d_fr
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
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