ES1DSR Ver la hoja de datos (PDF) - Micro Commercial Components
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Fabricante
ES1DSR Datasheet PDF : 3 Pages
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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Features
• For Surface Mount Applications
• Extremely Low Thermal Resistance
• Easy Pick And Place
• High Temp Soldering: 250°C for 10 Seconds At Terminals
• Superfast Recovery Times For High Efficiency
Maximum Ratings
• Operating Temperature: -50°C to +150°C
• Storage Temperature: -50°C to +150°C
• Maximum Thermal Resistance; 15 °C/W Junction To Lead
MCC
Catalog
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
ES1DSR ES1D
200V
140V
200V
ES1DSR
1 Amp Soft
Recovery Rectifier
200 Volts
DO-214AC
(HSMA) (High Profile)
H
Cathode Band
J
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IF(AV)
1.0A TJ = 75°C
Peak Forward Surge
IFSM
Current
30A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
Maximum DC
VF
.97V IFM = 1.0A;
TJ = 25°C*
Reverse Current At
IR
5µA TJ = 25°C
Rated DC Blocking
30µA TJ = 125°C
Voltage
Maximum Reverse
Recovery Time
Trr
50ns IF=0.5A, IR=1.0A,
Irr=0.25A
Typical Junction
Capacitance
CJ
45pF Measured at
1.0MHz, VR=4.0V
A
C
E
D
F
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.116
B
.067
.089
C
.002
.008
D
---
.02
E
.035
.055
F
.065
.096
G
.205
.224
H
.160
.180
J
.100
.112
MM
MIN
1.98
1.70
.05
---
.89
1.65
5.21
4.06
2.57
B
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
Revision: 3
www.mccsemi.com
2003/03/18
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