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BA3575 Ver la hoja de datos (PDF) - ROHM Semiconductor

Número de pieza
componentes Descripción
Fabricante
BA3575
ROHM
ROHM Semiconductor ROHM
BA3575 Datasheet PDF : 13 Pages
First Prev 11 12 13
Audio ICs
BA3575FS
FApplication notes
(1) “Pop” sound
By operating the BA3575FS according to the timing chart shown in Fig.3, it is possible to suppress generation of “pop”
noise in the headphone output.
(2) Application circuits
Provided the recommended circuit constants are used,
the application circuits should function correctly. Howev-
er, we recommend that you confirm the characteristics of
the circuits in actual use. If you change the circuit
constants, check both the static and transient character-
istics of the circuit, and allow sufficient margin to accom-
modate variations between both ICs and external com-
ponents.
In particular, the capacitors connected to the OUT 1,
OUT 2, and VREF pins must have low impedance at high
frequency, and have sufficient margin in their tempera-
ture characteristics.
Also, use an electrolytic or tantalum capacitor for the ca-
pacitor connected to the BIASOUT terminal.
(3) The PCB pattern for the external components
should be designed carefully to prevent oscillation and
degradation of the circuit characteristics. Keep the wiring
tracks as short as possible, and ensure that there is no
impedance between the common connections.
The ripple filter pins (1 and 2) and the bias amplifier pins
(3 and 4) cannot be used for external power supplies or
reference voltages.
881

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