ATA6626C(2014) Ver la hoja de datos (PDF) - Atmel Corporation
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ATA6626C Datasheet PDF : 29 Pages
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7. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Supply voltage VS
Pulse time ≤ 500ms; Ta = 25°C
Output current IVCC ≤ 85mA
Pulse time ≤ 2min; Ta = 25°C
Output current IVCC ≤ 85mA
WAKE (with 33kΩ serial resistor)
KL_15 (with 47kΩ/100nF)
DC voltage
Transient voltage due to ISO7637 (coupling 1nF)
INH
- DC voltage
LIN
- DC voltage
Logic pins (RxD, TxD, EN, NRES, NTRIG,
WD_OSC, MODE, TM)
Output current NRES
PVCC DC voltage
VCC DC voltage
ESD according to IBEE LIN EMC
Test Spec. 1.0 following IEC 61000-4-2
- Pin VS, LIN, KL_15 (47kΩ/100nF) to GND
- Pin WAKE (33kΩ serial resistor) to GND
ESD HBM following STM5.1 with 1.5kΩ 100pF
- Pin VS, LIN, KL_15, WAKE to GND
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
CDM ESD STM 5.3.1
Machine Model ESD AEC-Q100-RevF(003)
Junction temperature
Storage temperature
Symbol
VS
VS
VS
INRES
Tj
Ts
Min.
–0.3
–1
–150
–0.3
–27
–0.3
–0.3
–0.3
±6
±5
±6
±3
±750
±200
–40
–55
Typ.
Max.
Unit
+40
V
+40
V
27
V
+40
V
+100
V
VS + 0.3
V
+40
V
+5.5
V
+2
mA
+5.5
V
+6.5
V
KV
KV
KV
KV
V
V
+150
°C
+150
°C
8. Thermal Characteristics
Parameters
Symbol
Min.
Typ.
Max.
Unit
Thermal resistance junction to heat slug
Rthjc
Thermal resistance junction to ambient, where
heat slug is soldered to PCB
Rthja
10
K/W
35
K/W
Thermal shutdown of VCC regulator
150
165
170
°C
Thermal shutdown of LIN output
150
165
170
°C
Thermal shutdown hysteresis
10
°C
16 ATA6622C/ATA6624C/ATA6626C [DATASHEET]
4986O–AUTO–10/14
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