NX25M640C Ver la hoja de datos (PDF) - NexFlash -> Winbond Electronics
Número de pieza
componentes Descripción
Fabricante
NX25M640C Datasheet PDF : 7 Pages
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NX25M640C
2.59 [0.102]
45.00 [1.772]
3.20 [0.126] MAX
2.00 [0.079] MAX
1
OPTIONAL DUAL
CHIP DEVICE
15.00 [0.591]
1.00 [0.039] MIN
2
1.76 [0.069]
2.00 [0.079] MIN
0.76±0.08
14.75 [0.581]
3.00 [0.118]
23.00 [0.906] MAX
[0.030±0.003]
1.50 [0.060]
3
RADIUS 0.50 [0.020]
3.00 [0.118]
OPTIONAL DUAL
CHIP DEVICE
5.00 [0.20]
6.0 [0.24]
4
1.00
[0.040]
RADIUS 0.8 [0.03] 3PLCS
X.X
TOLERANCES:
[X.XX] = ±0.3 [±0.012]
5
NXD013A-0398
X.XX X [X.XXX] = ±0.1 [±0.004]
Figure 4. Serial Flash Module Package Dimensions (Inches are in parentheses)
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7
ABSOLUTE MAXIMUM RATINGS (1, 2)
Symbol Parameter
Vcc
VIN, VOUT
EDC
TST
Supply Voltage
Voltage Applied to Any Pin
Electro-static Discharge: Contact
to Insulating or Conductive Plate.
Storage Temperature
Conditions
Relative to Ground
JEIDA 4.1 Specification
Range
Unit
0 to 7.0
V
–0.5 to VCC + 0.5
V
±4,500
V
–40 to +85
°C
Note:
1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is
not guaranteed. Exposure beyond absolute maximum ratings (listed above) may cause permanent damage.
2. Proper care and handling of the Serial Flash Module is mandatory to ensure reliable operation. Avoid bending or subject-
ing the module to sudden impact. Avoid directly touching the connectors to protect from damage caused by static dis-
charge. NexFlash cannot accept and hereby disclaims liability for any damage to the modules, including data corruption
that may occur due to mishandling.
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NexFlash Technologies, Inc.
5
PRELIMINARY NXSF033A-0502
05/30/02 ©
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