NX25M640C-3T Ver la hoja de datos (PDF) - NexFlash -> Winbond Electronics
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NX25M640C-3T Datasheet PDF : 7 Pages
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NX25M640C
Vcc
C1
CS1*
C2 (11)
CS0
SCK
SO
SI
WP/DT
Detect Control*
C4 (11)
C3 (2)
C7 (3)
C8 (13)
C6 (12)
10K
WPS*
MICROCONTROLLER
(DSP or ASIC)
* OPTIONAL
C5
CS0
SCK
CS1
Vcc
(4) (1)
CS1 R/B Hold*
#1
CS0
SCK
SO
SI
WP/DT
Vcc
#0
Serial Flash
Memory
SPI Interface
25F640C
GND
R/B
Hold
(14)
(1)
SI
SO
WP/DT
GND
Vcc
CS1
SCK
CSO
CSO
SCK
CS1
Vcc
C1
C5 GND
C2 DT C6 WP/DT
C3
C7 SO
C4
C8 SI
BOTTOM VIEW (CONTACT SIDE)
C4
C3
C2 DT
C1
C8 SI
C7 SO
C6 WP/DT
C5 GND
NX25M640C
Serial Flash
Module
TOP VIEW (LABEL SIDE)
Figure 2. Typical interface for Serial Flash Module with SPI Interface using NX25F640C Series Devices.
Equivalent pin numbers for TSOP (Type II) are listed in parentheses. SPI contact assignments are shown for Bottom
and Top Views of Serial Flash Module and Top View of the ITT Cannon Slide-insertion Connector (Model CCM-03-3504).
Pin Descriptions
Note: See NX25F640C Data Sheets for further information
Power Supply Pins (Vcc and Gnd)
Supply source for 5V or 3V. Contact layout allows for the
module to be inserted and removed while power is applied
(“hot-socketing”) without damaging the module’s memory
device.
Serial Data Input (SI)
The SPI bus Serial Data Input (SI) provides a means for
commands or data to be written to (shifted into) the device.
Serial Data Output (SO)
The SPI bus Serial Data Output (SO) provides a means for
data to be read from (shifted out of) the device. When the
device is deselected (CS=1) SO pin is in a high-impedance
state.
Serial Clock (SCK)
All commands and data written to the Serial Input (SI) are
clocked relative to the rising edge of Serial Clock (SCK). All
data read from the Serial Data Output (SO) is clocked
relative to the falling edge of SCK.
Chip Selects (CS0 and CS1)
Chip select inputs are asserted low. CS0 selects device
location 0, which is on the contact side of the module. CS1
selects device location 1, which is located on the opposite
side of module from device #0. CS1 is only used when a
module has two serial flash memories. Contact NexFlash
for more information regarding two Serial Flash Memories
on a single module.
Write Protect/Detect (WP/DT)
The Write Protect/Detect pin is an optional dual function pin.
Write Protect (WP)
Used as a Write Protect Input (WP), when WP is asserted
(active low) the entire flash memory array is Write Pro-
tected. WP can be controlled by the interface or as an
optionally available contact pad directly on the module.
Detect (DT)
Using a pull-up resistor, a card detect (DT) can provide a low
to high or high to low transition when the module is inserted
or removed. The pulse is best used in conjunction with an
interrupt input of a microcontroller or processor.
R/B Hold
The Ready/Busy-Hold pin function is not available for use
with the SFM. This pin must be set to “No Connect” in the
NX25Fxxx configuration register.
4
NexFlash Technologies, Inc.
PRELIMINARY NXSF033A-0502
05/30/02 ©
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