NX26M080A Ver la hoja de datos (PDF) - NexFlash -> Winbond Electronics
Número de pieza
componentes Descripción
Fabricante
NX26M080A Datasheet PDF : 7 Pages
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NX25Mxxx
NX26Mxxx
2.59 [0.102]
1.76 [0.069]
3.00 [0.118]
NXD013A-0398
45.00 [1.772]
14.75 [0.581]
3.00 [0.118]
2.00 [0.079] MIN
23.00 [0.906] MAX
3.20 [0.126] MAX
2.00 [0.079] MAX
1.00 [0.039] MIN
OPTIONAL DUAL
CHIP DEVICE
15.00 [0.591]
0.76±0.08
[0.030±0.003]
1.50 [0.060]
RADIUS 0.50 [0.020]
OPTIONAL DUAL
CHIP DEVICE
5.00 [0.20]
RADIUS 0.8 [0.03] 3PLCS
X.X
[X.XX] = ±0.3 [±0.012]
TOLERANCES:
X.XX X [X.XXX] = ±0.1 [±0.004]
6.0 [0.24]
1.00
[0.040]
Figure 4. Serial Flash Module Package Dimensions TSOP with epoxy version
(Inches are in parentheses)
2.59 [0.102]
1.76 [0.069]
3.00 [0.118]
NXD013A-0398
45.00 [1.772]
14.75 [0.581]
3.00 [0.118]
2.00 [0.079] MIN
23.00 [0.906] MAX
3.20 [0.126] MAX
2.00 [0.079] MAX
OPTIONAL DUAL
CHIP DEVICE
15.00 [0.591]
1.00 [0.039] MIN
0.76±0.08
[0.030±0.003]
1.50 [0.060]
RADIUS 0.50 [0.020]
OPTIONAL DUAL
CHIP DEVICE
5.00 [0.20]
RADIUS 0.8 [0.03] 3PLCS
X.X
[X.XX] = ±0.3 [±0.012]
TOLERANCES:
X.XX X [X.XXX] = ±0.1 [±0.004]
6.0 [0.24]
1.00
[0.040]
Figure 5. Serial Flash Module Package Dimensions COB with epoxy version
(Inches are in parentheses)
4
NexFlash Technologies, Inc.
PRELIMINARY NXSF012B-0599
02/22/00 ©
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