NDM3000 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
NDM3000 Datasheet PDF : 12 Pages
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Typical Thermal and Electrical Characteristics
3.5
3
1a
2.5
2
1.5 1b
1c
4.5"x5" FR-4 PCB
1
Ta = 25C
Still Air
0.5
0
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2)
Figure 23. SOIC-16 3 Leadframe Device DC Power
Dissipation versus Copper Mounting Pad Area
4
3.5
3
1a
2.5
1b
2 1c
1.5
1
0
4.5"x5" FR-4 PCB
Ta = 25C
Still Air
Vgs = -10V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2)
Figure 24. P-Ch DC Drain Current Capability versus
Copper Mounting Pad Area.
5
4.5
1a
4
3.5
1b
3 1c
2.5
2
0
4.5"x5" FR-4 PCB
Ta = 25C
Still Air
Vgs = 10V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2)
Figure 25. N-Ch DC Drain Current Capability
versus Copper Mounting Pad Area.
10
3
RDS(ON) LIMIT
1
0.3
0.1
0.03
V GS = ±10V
SINGLE PULSE
R θJ A = See Note 1c
T A = 25°C
1
0
1m
ms
s
100ms
1s
10s
DC
0.01
0.1 0.2
0.5
1
2
5
10
±V DS , DRAIN-SOURCE VOLTAGE (V)
30 50
Figure 26. P-Ch Typical Safe Operating Area
1
0.5
0.2
0.1
0.05
0.02
0.01
0.005
0.002
0.001
0.0001
D = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
0.001
0.01
0.1
1
t1 , TIME (sec)
R θJA (t) = r(t) * RθJA
R θJA = See Note 1c
P(pk)
t1
t2
TJ - TA = P * R θJA (t)
Duty Cycle, D = t 1 / t 2
10
100
300
Figure 27. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDM3000 Rev. E
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