ASX621 Ver la hoja de datos (PDF) - ASB Inc
Número de pieza
componentes Descripción
Fabricante
ASX621 Datasheet PDF : 10 Pages
| |||
Outline Drawing
ASX621
DC-3000 MHz MMIC Amplifier
Symbols
A
A1
A2
B
C
D
E1
e
E
L
y
θ
L1
Dimensions (In mm)
MIN
NOM
MAX
1.40
1.50
1.60
0.00
--
0.10
--
1.45
--
0.33
--
0.51
0.19
--
0.25
4.80
--
5.00
3.80
3.90
4.00
--
1.27
--
5.80
6.00
6.20
0.40
--
1.27
--
--
0.10
0°
--
8°
0.95
1.05
1.15
(Unit: mm)
Pin No.
1
2
3
4
Function
2nd stage RF IN
1st stage RF OUT
GND
1st stage RF IN
Pin No.
5
6
7
8
Function.
GND
2nd stage RF OUT
2nd stage RF OUT
GND
Mounting Recommendation (in mm)
Note: 1. Add as much copper as possible to inner and outer layers near the part to ensure
optimal thermal performance.
2. To ensure reliable operation, device ground paddle-to-ground pad soldering is critical.
3. Add mounting screws near the part to fasten the board to a heat sinker. Ensure that
the ground / thermal via region contacts the heat sinker.
4. A proper heat dissipation path underneath the area of the PCB for the mounted device
is strictly required for proper thermal operation. Damage to the device can result from
inappropriate heat dissipation.
ESD Classification
HBM
Class 1B
Voltage Level: 500 V~1000 V
MM
Class A
Voltage Level: <200 V
CAUTION: ESD-sensitive device!
Moisture Sensitivity Level (MSL)
Level 3 at 260°C reflow
10/10
ASB Inc. • sales@asb.co.kr • Tel: +82-42-528-7223
August 2008
Share Link: 