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ASM0912C Ver la hoja de datos (PDF) - APLUS INTEGRATED CIRCUITS

Número de pieza
componentes Descripción
Fabricante
ASM0912C Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
1.4 Bonding Diagram
ASM0912C
19
18
17 16 15
14 13
12
RC3 RC2 RC1 RC0 GND2 VDD2 TEST OSC
( 32K x 10-bit ) Block ROM
ASM0912C
RA3 RA2 RA1 RA0 VDD1 COUT GND1 RB0
RB1 RB2 RB3
1
23 4
567
8
9
10
11
Substrate must be connected to GND.
ASM0912C Pad Location
PAD # PAD Name
1 RA3
2 RA2
3 RA1
4 RA0
5 VDD1
6 COUT
7 GND1
8 RB0
9 RB1
10 RB2
X
-682.16
-559.84
-437.52
-315.2
-191.28
71.12
189.52
307.92
430.24
552.56
Chip Size: X= 1540+80
Y
PAD # PAD Name
-638.92 11 RB3
-638.92 12 OSC
-638.92 13 TEST
-638.92 14 VDD2
-638.92 15 GND2
-638.92 16 RC0
-638.92 17 RC1
-638.92 18 RC2
-638.92 19 RC3
-638.92
(um), Y=1510+80
X
674.88
633.56
432.48
273.16
134.68
-51.76
-248.4
-454.24
-650.88
(um)
Y
-638.92
670.24
670.24
670.24
670.24
670.24
670.24
670.24
670.24
5
Rev 1.0

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