AS1335 Ver la hoja de datos (PDF) - austriamicrosystems AG
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AS1335 Datasheet PDF : 19 Pages
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AS1335
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
lid VIN to GND
SW to GND
EN, FB to GND
a P-Channel Switch Source Current (DC)
v N-Channel Switch Source Current (DC)
Peak SW Sink and Source Current
ill Thermal Resistance ΘJA
Latch-Up
t Electrostatic Discharge
G s Operating Temperature Range
Storage Temperature Range
A t Junction Temperature
Technicaaml sconten PackageBodyTemperature
Min Max Units
Comments
-0.3
6
V
-0.3 VIN + 0.3 V
-0.3
VIN
V
1.5
A
1.5
A
3
A
36.7 ºC/W
on PCB
-100 100
mA
@85°C, JEDEC 78
2
kV
HBM MIL-Std. 883E 3015.7 methods
-40
+85
ºC
-65 +150 ºC
125
ºC
+260
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
ºC Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
www.austriamicrosystems.com/DC-DC_Step-Down/AS1335
Revision 1.03
3 - 18
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