AS1116-BQFT Ver la hoja de datos (PDF) - austriamicrosystems AG
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AS1116-BQFT Datasheet PDF : 24 Pages
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AS1116
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
lid Input Voltage Range
VDD to GND
All other pins to GND
a Current
DIG0:DIG7 Sink Current
SEGA:SEGG, SEGDP
v Input Current (latch-up immunity)
Electrostatic Discharge
ill Electrostatic Discharge
t Thermal Information
Digital outputs
All other pins
G s Thermal Resistance ΘJA
A t Temperature Ranges and Storage Conditions
Junction Temperature
s n Storage Temperature
m te Package Body Temperature
a on Humidity non-condensing
Technical c Moisture Sensitive Level
QSOP-24 package
TQFN(4x4)-24 package
Min
Max Units
Notes
-0.3
7
V
-0.3
7 or
VDD + 0.3
V
500
mA
100
mA
±100
mA
Norm: JEDEC 78
1000
V
1000
V
Norm: MIL 833 E method 3015
88
ºC/W
30.5 ºC/W
on PCB, QSOP-24 package
on PCB, TQFN(4x4)-24 package
+150
-55
+150
+260
5
85
1
3
°C
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
ºC Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
%
% Represents a max. floor life time of unlimited
%
Represents a max. floor life time 168h
www.austriamicrosystems.com/LED-Driver-ICs/AS1116
Revision 1.08
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