AS1108 Ver la hoja de datos (PDF) - austriamicrosystems AG
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AS1108 Datasheet PDF : 19 Pages
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AS1108
Data Sheet
austriamicrosystems
4 Absolute Maximum Ratings
Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical
Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 1. Absolute Maximum Ratings
Parameter
Min
Max Units
Notes
VDD
-0.3
7
V
Voltage (with respect to DIN, CLK, LOAD/CSN -0.3
7
V
GND)
7 or
All Other Pins
-0.3
VDD +
V
0.3
Current
DIG 0:DIG 3
Sink Current
SEG A:SEG G, SEG DP
500 mA
100 mA
Continuous Power
Dissipation (TAMB = +85ºC)
Narrow Plastic DIP
Wide SOIC
1066
941
mW Derate 13.3mW/ºC above +70ºC
mW Derate 11.8mW/ºC above +70ºC
Operating Temperature Ranges (TMIN toTMAX)
Storage Temperature Range
Package Body Temperature (Wide SOIC) 1
0
+70
ºC
-65
+150
ºC
+260 ºC
Soldering Temperature (Narrow DIP) 2
Humidity
+260 ºC
5
85
%
Non-condensing
Electrostatic Discharge 3
Digital Outputs
All Other Pins
1000
V
1000
V
Latch-Up Immunity 4
±200 mA
All pins.
Except pin 11: ±180mA.
1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020C
“Moisture/Reflow Sensitivity Classification for non-hermetic Solid State Surface Mount Devices”.
2. Specified according JESD22-B106 “Resistance to Soldering Temperature for Through-Hole Mounted Devices”.
3. Norm: MIL 883 E method 3015.
4. Norm: JEDEC 17.
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