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APX9270 Ver la hoja de datos (PDF) - Anpec Electronics

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APX9270 Datasheet PDF : 17 Pages
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APX9270
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm3
<350
<2.5 mm
240 +0/-5°C
2.5 mm
225 +0/-5°C
Volume mm3
350
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm3
Volume mm3
Volume mm3
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C)
at the rated MSL level.
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Anpec Electronics Corp.
Head Office :
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Hsin-Chu, Taiwan
Tel : 886-3-5642000
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Copyright © ANPEC Electronics Corp.
17
Rev. A.3 - Jun., 2008
www.anpec.com.tw

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