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APX9270 Ver la hoja de datos (PDF) - Anpec Electronics

Número de pieza
componentes Descripción
Fabricante
APX9270 Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
APX9270
Package Information
TSSOP-20P
D
D1
EXPOSE
D PAD
SEE VIEW A
e
b
c
L
VIEW A
GAUGE PLANE
SEATING PLANE
S
TSSOP-20P
Y
M
B
MILLIMETERS
INCHES
O
L
MIN.
MAX.
MIN.
MAX.
A
1.20
0.047
A1
0.05
0.15
0.002
0.006
A2
0.80
1.05
0.031
0.041
b
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.008
D
6.40
6.60
0.252
0.260
D1
2.20
5.00
0.087
0.197
E
6.40 BSC
E1
4.30
4.50
E2
1.50
4.00
e
0.65 BSC
L
0.45
0.75
0
0o
8o
0.169
0.059
0.252 BSC
0.177
0.157
0.018
0o
0.026 BSC
0.030
8o
Note : 1. Follow JEDEC MO-153 ACT.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright © ANPEC Electronics Corp.
14
Rev. A.3 - Jun., 2008
www.anpec.com.tw

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