APW7158 Ver la hoja de datos (PDF) - Anpec Electronics

Número de pieza

componentes Descripción

Fabricante

APW7158

Dual Synchronous Buck PWM Controllers

Anpec Electronics 

APW7158

Ordering and Marking Information

APW7158

Assembly Material

Handling Code

Temperature Range

Package Code

Package Code

K : SOP-20

Operating Ambient Temperature Range

E : -20 to 70 oC

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APW7158 K:

APW7158

XXXXX

XXXXX - Date Code

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Absolute Maximum Ratings (Note 1)

Symbol

Parameter

Rating

Unit

VCC12

VCC, Separate Supply

VUGATE1, VUGATE2, VBOOT1, VBOOT2

VLGATE1, VLGATE2

VFS

VREFIN, VREFOUT, VREF

VFB1, VCOMP1, VFB2, VCOMP2

VSS1/EN1, VSS2/EN2

TA

TJ

TSTG

TSDR

VCC12 to GND Voltage

VCC, Separate Supply to GND Voltage

UGATE1, UGATE2, BOOT1, BOOT2 to PGND Voltage

LGATE1, LGATE2 to GND Voltage

FS to GND Voltage

REFIN, REFOUT, VREF to GND Voltage

FB1, COMP1, FB2, COMP2 to GND Voltage

SS1/EN1, SS2/EN2, to GND Voltage

PGND to GND Voltage

Operating Temperature Range

Maximum Junction Temperature

Storage Temperature Range

Maximum Lead Soldering Temperature, 10 Seconds

-0.3 to 20

V

-0.3 to 5.5

V

-0.3 to 30

V

-0.3 to 20

V

-0.3 to 20

V

-0.3 to VCC

V

-0.3 to VCC

V

-0.3 to VCC

V

-0.3 to +0.3

V

-20 to +70

oC

+150

oC

-65 to +150

oC

260

oC

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

θJA

θJC

Parameter

Junction-to-Ambient Resistance in Free Air (Note 2)

Junction-to-Case Resistance in Free Air (Note 3)

SOP-20

SOP-20

Typical Value

75

20

Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

Note 3: The case temperature is measured at the center of the exposed pad on the underside of the SOP-20 package.

Unit

oC/W

oC/W

Copyright © ANPEC Electronics Corp.

2

Rev. A.2 - Aug., 2009

www.anpec.com.tw

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